| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an assembly substrate that is easily handled and suppress the occurrence of warpage and has improved productivity and cost effectiveness. <P>SOLUTION: A work board 100 includes an insulating layer on one surface of a substantially rectangular substrate 11, and electronic components 41 and a plate-like integrated frame 51 are embedded inside the insulating layer. The plate-like integrated frame 51 has a plurality of recesses 53 arranged in parallel at its inner periphery wall, and arranged on a non-mount area of the electronic components 41 to surround a plurality of electronic components (groups) 41. <P>COPYRIGHT: (C)2009,JPO&INPIT |
