发明名称 SUBSTRATE-TREATING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate-treating device capable of preventing the poor treatment quality of a substrate caused by the state of an edge. <P>SOLUTION: A main controller inspects the state of the edge of a substrate by an inspection head while the rotation of the substrate W is being maintained (step S4), and determines whether a coating liquid has adhered to the edge of the substrate, based on the inspection result (step S5). When no coating liquids have adhered to the edge of the substrate, the rotation of the substrate by spin chuck is stopped and the substrate W is carried out of a coating unit by a first center robot (step S6). When the coating liquid has adhered to the edge of the substrate, a removing liquid is discharged onto the substrate from a removing liquid supply nozzle while the rotation of the substrate is being maintained (step S7), thus removing the coating liquid applied onto the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009032887(A) 申请公布日期 2009.02.12
申请号 JP20070195032 申请日期 2007.07.26
申请人 SOKUDO:KK 发明人 NISHIMURA JOICHI;YOSHII HIROYUKI;NISHIYAMA KOJI
分类号 H01L21/027 主分类号 H01L21/027
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