发明名称 Electromagnetic bandgap structure and printed circuit board
摘要 An electromagnetic bandgap structure and a printed circuit board having the electromagnetic bandgap that intercepts the transfer of a signal ranging a frequency band are disclosed. The electromagnetic bandgap structure includes a metal layer; a dielectric layer, stacked on the metal layer; at least two metal plates, stacked on the same planar surface of the dielectric layer; and a stitching via, connecting the adjacent metal plates. The stitching via passes through the dielectric layer, and a part of the stitching via is placed on the same planar surface of the metal layer. With the present invention, the electromagnetic bandgap can decrease the noise of a particular frequency by having a compact size and a low bandgap frequency.
申请公布号 US2009039984(A1) 申请公布日期 2009.02.12
申请号 US20080010561 申请日期 2008.01.25
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM HAN;YOO JE-GWANG;RYU CHANG-SUP
分类号 H01P1/20 主分类号 H01P1/20
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