发明名称 APPARATUS FOR BLANKING PRINTED CIRCUIT BOARD
摘要 An apparatus for punching substrate is provided to prevent the substrate from breaking away from the clamping device by performing the punching operation at the position close to the lower metal mold. The upper mold and the lower mold are arranged in the base frame(10). A pair of clamp arms (22) is installed on the base frame side by side. The clamps of 4 corner points (241,242,243,244) clamp the 4 corner points of the square shaped substrate (S). A pair of corner point clamp is installed at each clamp arm respectively. At least a pair of edge clamps (245,246) clamps the edge part of substrate. At least a pair of edge clamp is installed at each clamp arm. One of the corner point clamps the edge of substrate as the fixed clamp. The corner point clamp which is adjacent to the fixed clamp in the longitudinal direction of substrate provides the tension to the longitudinal direction of substrate. The corner point clamp which is adjacent to the fixed clamp in the width direction of substrate provides the tension to the width direction of substrate. The corner point clamp facing the fixed clamp to the diagonal direction of substrate provides the tension in the width direction and longitudinal direction of substrate.
申请公布号 KR100883176(B1) 申请公布日期 2009.02.12
申请号 KR20080028574 申请日期 2008.03.27
申请人 SEHO ROBOT IND. CO., LTD. 发明人 KIM, SE YOUNG
分类号 H05K13/00 主分类号 H05K13/00
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