SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To reduce the distribution of the width of a word line. SOLUTION: The method of manufacturing the semiconductor device has: a step of forming a bit line 12 inside a semiconductor substrate 10; a step of forming the plurality of word lines 22 in a fixed cycle crossing the bit line 12 on the semiconductor substrate 10; a step of removing a part of the plurality of word lines 22; a step of forming an interlayer dielectric on the semiconductor substrate 10; and a step of forming a plug metal 28 connected to the bit line through the interlayer dielectric in a region 40 where the part of the word lines is removed. COPYRIGHT: (C)2009,JPO&INPIT