| 摘要 |
A semiconductor device includes a semiconductor construct constructed by a semiconductor substrate and a plurality of external connection electrodes provided under the semiconductor substrate. A lower insulating film is provided under and outside the semiconductor construct. A sealing film is provided on the lower insulating film to cover a periphery of the semiconductor construct. A plurality of lower wiring lines are provided under the lower insulating film and connected to the external connection electrodes of the semiconductor construct, respectively.
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