| 摘要 |
The invention relates to a heat exchange system for electronic devices, preferably data processing devices, comprising high-performance processors or having a high processor density. The heat exchange system comprises essentially a primary cooling circuit and a secondary cooling circuit both being thermally associated to the one or more processor unit(s). The secondary cooling circuit is configured as a completely closed system, the coolant in the secondary cooling circuit being driven exclusively by mechanical or inductive coupling with the flow drive of the primary cooling circuit
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