| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection with a high reflectance from a visible light to a near-ultraviolet light, superior in anti-thermal degradation and also hardly making a resin dusting on its transfer molding, a substrate for loading a photosemiconductor element and a photosemiconductor device using the above. <P>SOLUTION: The thermosetting resin composition for light reflection contains a thermoset resin component, a white pigment and an additive and has a length of flash which is generated on carrying out transfer molding under the conditions of a molding temperature of 180°C, a molding pressure of 6.9 MPa and a curing time 90 s is not more than 5 mm, and a light reflectance at wavelength of 350 nm to 800 nm of the resin after heat curing is 80% or more. <P>COPYRIGHT: (C)2009,JPO&INPIT |
