| 摘要 |
PROBLEM TO BE SOLVED: To enable embedding of a defect-free wiring material in recesses for wiring, such as trenches, by carrying out electroplating directly on a surface of a ruthenium film serving as a barrier layer. SOLUTION: A substrate treating method comprises the steps of: preparing a substrate having the ruthenium film formed on its entire substrate surface including the surfaces of the recesses for wiring; keeping the substrate surface in contact with a plating solution for a prescribed time so that an additive in the plating solution is adsorbed onto the ruthenium film; and subsequently carrying out electroplating to form a conductive film on the surface of the ruthenium film. COPYRIGHT: (C)2009,JPO&INPIT
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