| 摘要 |
PROBLEM TO BE SOLVED: To provide a joining method capable of joining two substrates rigidly with high dimensional precision and efficiently at a low temperature to each other, and forming a layer having conductivity between the two substrates, to provide a joint article which is made by joining two substrates rigidly with high dimensional precision to each other and is provided with a layer having conductivity, and to provide a wiring board having high reliability, which is provided with such a joint article. SOLUTION: The joining method has a process of forming a plasma-polymerized film 3 including a conductive component on a first substrate 21 to obtain a first adherend 41, and further preparing a second substrate 22 (a second adherend 42); a process of superposing the first adherend 41 and the second adherend 42 so as to cause the plasma-polymerized film 3 to adhere to the second substrate 22 to obtain a temporary joint article 5; and a process of joining the plasma-polymerized film 3 to the second substrate 22 and imparting the conductivity to the plasma-polymerized film 3 to obtain the joint article 1 by applying ultraviolet rays to the plasma-polymerized film 3 in the temporary joint article 5. COPYRIGHT: (C)2009,JPO&INPIT
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