SOLDER ALLOY, SOLDER BALL AND ELECTRONIC MEMBER HAVING SOLDER BUMP

摘要

PROBLEM TO BE SOLVED: To provide a solder alloy used for the connection with a motherboard board or the like, having high resistance to impact due to falling and having a melting point of <250°C, and also to provide a solder ball and an electronic member having a solder pump. SOLUTION: The solder alloy has a composition comprising boron of 0.1 to 200 ppm by mass, and the balance substantially Sn of≥40 mass%, and has a melting point of <250°C. COPYRIGHT: (C)2009,JPO&INPIT