发明名称 Thin Multijunction Solar Cells With Plated Metal OHMIC Contact and Support
摘要 A method of forming a thin multifunction solar cell in which an electroplating process is used to form a thick metal layer to give strength and support to the solar cell. The strain of the plated thick metal layer is adjusted during the process by parameter control to compensate for the strain in the other device layers, so that the curvature of the thin device can be eliminated or otherwise controlled.
申请公布号 US2009038679(A1) 申请公布日期 2009.02.12
申请号 US20070836402 申请日期 2007.08.09
申请人 EMCORE CORPORATION 发明人 VARGHESE TANSEN;CORNFELD ARTHUR;XIE MICHELLE
分类号 H01L31/042;H01L21/62 主分类号 H01L31/042
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