Semiconductor device for use with system, has isolating body, semiconductor chip with active surface and back side that is opposite to active surface, where semiconductor chip is arranged in isolating body

摘要

The semiconductor device packing (200) has an isolating body (108), a semiconductor chip (106) with an active surface and a back side opposite to the active surface. The semiconductor chip is arranged in the isolating body and the active surface is opened by the isolating body. A support (104) is arranged in the isolating body adjacent to a side of the semiconductor chip. The support has an upper side and a lower side, where a side surface is provided between the upper side and the lower side. An independent claim is included for a method for manufacturing a semiconductor device.