LIGHT EMITTING DIODE PACKAGE

摘要

A light emitting diode package capable of improving productivity with high heat dissipation efficiency is provided to maintain heat dissipation efficiency of a light emitting diode package with simple structure by emitting heat of an LED chip to outside using a via pattern without a separate heat sink. A first electrode pad(111a) and a second electrode pad(111b) are formed on one side of a substrate. A first soldering pad(112a) and a second soldering pad(112b) are formed on the other side of the substrate. The first electrode pad and the first soldering pad are connected by a first via pattern(113a). The second electrode pad and the second soldering pad are connected by a second via pattern(113b). A LED chip(130) is mounted on the first electrode pad. The first electrode pad is connected to a top of the first via pattern. A cross sectional area of the first via pattern is greater than a cross sectional area of the second via pattern.