| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting a conductive ball such as a minute solder ball on the connection pad of a substrate without inserting the solder ball between a mask and a head. <P>SOLUTION: The conductive ball mounting apparatus has: the head 30 having an outer frame 10 and an inner cylinder 20 provided in the outer frame; and the mask 14 having an opening 12 at the mounted position of the conductive ball and an exhaust port 16 for exhausting air from an upper surface of the mask to the outside at the lower end of the outer frame 10. The inner cylinder 20 is arranged above the mask 14 in the outer frame 10, and is divided into upper and lower spaces by a sieve 22. The upper space 24 composes a tentative storage chamber of conductive balls where a conductive ball supply port 28 is open at an upper end of the inner cylinder 20, the lower space 26 has an air inlet that has an open at an lower end thereof and feeds air from a lower portion of the sieve to the outside. Vibratory equipment can vibrate the inner cylinder 20 without being essentially restricted by the outer frame 10, thereby mounting the conductive balls for each target area for arranging each conductive ball on the substrate. <P>COPYRIGHT: (C)2009,JPO&INPIT |
