| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-curable silicon-containing film-forming composition that forms an excellent pattern by using a formed silicon-containing intermediate film and ensures effective transfer of a photoresist pattern and accurate processing of a substrate. <P>SOLUTION: The heat-curable silicon-containing film-forming composition comprises (A) a silicon-containing compound obtained through hydrolytic condensation of a hydrolyzable silicon compound in the presence of an acid catalyst, (B) a compound represented by the formula (1): L<SB>a</SB>H<SB>b</SB>X (wherein L is Li, Na, K, Rb or Ce; X is a hydroxy group or an organic acid group; a is ≥1; and b is 0 or ≥1) or (2) a compound represented by the formula (2): M<SB>a</SB>H<SB>b</SB>A (wherein M is sulfonium, iodonium or ammonium; and A is the X or a nonnucleophilic counter ion), (C) an organic acid, (D) an alcohol containing a cyclic ether as a substituent group and (E) an organic solvent. <P>COPYRIGHT: (C)2009,JPO&INPIT |
