| 摘要 |
PROBLEM TO BE SOLVED: To provide a boiling cooler wherein a plurality of cooling units are placed in parallel and condensers of the units are located in cascade in an air duct that is enhanced so that dust and dirt are hardly stored in cooling wind pathways of the condensers and the condensers can simply be cleaned by only air blow at maintenance. SOLUTION: In the boiling cooler, each cooling unit 2 is configured such that the condenser 6 is placed to the upper part of a tank 5 to which a coolant 4 is sealed, a power semiconductor module 1 is thermally conductively fitted to the tank, the condensers are placed in cascade along a conducting wind pathway of the air duct 3, and cooling air is supplied to the air duct to cool the semiconductor module. The cooling wind pathways 6c of the condensers placed in front and back are connected, and many common heat dissipation fins 8 are succeedingly placed between the entrance of the cooling wind pathways of the upwind condenser and the exit of the cooling wind pathways of the downwind condenser. Concretely, the upwind condenser and the downwind condenser are overlapped in front and back, and the cooling wind pathways of the condensers are connected to install the long common heat dissipation fins which are brazed to a coolant duct 6a. COPYRIGHT: (C)2005,JPO&NCIPI |
