发明名称 |
METHOD FOR BONDING A SEMICONDUCTOR SUBSTRATE TO A METAL SUBSTRATE |
摘要 |
<p>A method of bonding a semiconductor substrate to a metal substrate is disclosed. In some embodiments the method includes forming a semiconductor device in a semiconductor substrate, the semiconductor device comprising a first surface. The method further includes obtaining a metal substrate. The metal substrate is bonded to the first surface of the semiconductor device, wherein at least a portion of the metal substrate forms an electrical terminal for the semiconductor device.</p> |
申请公布号 |
KR20090015915(A) |
申请公布日期 |
2009.02.12 |
申请号 |
KR20087027034 |
申请日期 |
2007.03.12 |
申请人 |
FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
WANG QI;YILMAZ HAMZA;LI MINHUA;WU CHUNG LIN |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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