| 摘要 |
A semiconductor package is provided to confirm the attachment of the semiconductor chip by making a semiconductor chip adhered to the top of the substrate based on the semiconductor chip recognition mark. In a semiconductor package, a semiconductor chip(302) including a plurality of bonding pads at the center of the top of it comprises a window at the center. The semiconductor chip is adhered on the strip level substrate(304) in which a plurality of electrode terminals is formed in the part adjacent to the window through a face-down type. An electrode terminal adjacent to the window of the substrate and the bonding pad of the semiconductor are connected with a wire penetrating the window. A semiconductor chip recognition mark(300) of the square shape is formed at each corner(306) to attach the semiconductor chip exactly.
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