发明名称 PHOTOSENSITIVE DRY FILM RESIST, PRINTED WIRING BOARD USING THE SAME, AND MANUFACTURING METHOD OF PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive dry film resist, a manufacturing method therefor, and usage of it, which enables aqueous development and has superior resolution, flame retardancy, adhesion, moisture resistance, electrical reliability, sensitivity, and ease of handling. <P>SOLUTION: The photosensitive dry film resist has two or more layers including at least a first photosensitive layer and a second photosensitive layer. The first photosensitive layer contains a binder polymer, a (meth)acrylic compound, a photoreaction initiator, and a flame retardant as essential components. The second photosensitive layer contains a binder polymer, a (meth)acrylic compound, a dye, and/or a pigment as essential constituents. The second photosensitive layer substantially does not contain flame retardants, and contents of the dye and/or the pigment in the second photosensitive layer are higher than those of the first photosensitive layer. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009031344(A) 申请公布日期 2009.02.12
申请号 JP20070192194 申请日期 2007.07.24
申请人 KANEKA CORP 发明人 YAMANAKA TOSHIO;OKADA YOSHIFUMI;NOJIRI HITOSHI
分类号 G03F7/004;C08F2/44;C08F283/04;C08F291/00;G03F7/031;G03F7/033;G03F7/037;H05K3/28 主分类号 G03F7/004
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