| 摘要 |
<p>The assembly (1) has a continuous recess arranged below an electronic component in a circuit carrier (2) e.g. printed circuit board. A die of thermoconducting material is inserted in an end of a joining region (6a) in the recess, is attached with a thermo conducting adhesive layer (7) and is thermocondctively connected with the component. The die has a joining region (6b) in a side, where a cross sectional area of the region (6b) is partially larger than the recess in the circuit carrier. An end of the region (6b) is thermocondctively connected with a cooling element (8). The die is provided with an electric insulating coating e.g. anodized coating, lacquer coating, enamel coating or electrically insulated foil coating, and consists of a ceramic material. An independent claim is also included for a method for manufacturing a circuit carrier assembly.</p> |
