发明名称 Carrier for stacked type semiconductor device and method of fabricating the same
摘要 A carrier for a stacked type semiconductor device includes a lower carrier having a first accommodating portion that accommodates a first semiconductor device, and an upper carrier having a second accommodating portion that accommodates a second semiconductor device stacked on the first semiconductor device so as to be placed in position on the first semiconductor device. It is thus possible to eliminate an additional device used for stacking the semiconductor device, and thereby reduce the cost.
申请公布号 GB2429582(B) 申请公布日期 2009.02.11
申请号 GB20060022769 申请日期 2004.05.11
申请人 SPANSION LLC;SPANSION JAPAN LIMITED 发明人 MASANORI ONODERA;JUNICHI KASAI;KOUICHI MEGURO;JUNJI TANAKA;YASUHIRO SHINMA;KOJI TAYA
分类号 H01L25/10;H01L21/48;H01L23/02 主分类号 H01L25/10
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