发明名称 Method and installation for fracturing a composite substrate via an embrittlement plane
摘要 The method involves realizing fracture of a composite structure (100) along a fragilization plane defined between a thin layer and a rest layer i.e. negative layer, of a donor substrate e.g. gallium nitride plate. The composite structure is maintained against stiffeners (118) at the moment of releasing of energy during fracturing of the structure, where the stiffeners are placed on both sides of the structure and spaced from the structure. An independent claim is also included for a housing for a pod of a thermal annealing installation.
申请公布号 EP2023380(A1) 申请公布日期 2009.02.11
申请号 EP20080160680 申请日期 2008.07.18
申请人 S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES 发明人 LEGROS, DAVID
分类号 H01L21/18;H01L21/00;H01L21/762 主分类号 H01L21/18
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