| 摘要 |
An electronic apparatus comprises a protective housing formed from a thermosetting material, wherein at least some of the electronic components of the electronic apparatus are integrated into said protective housing. Components 20, 30, 40, 50, 60, 70 are mounted on a printed circuit board 10 or some other mechanical support, and the entire structure is encapsulated in a thermoset resin 80 to form a protective housing. The electronic apparatus may be a mobile telephone or may be a power cell for an electronic device. In some embodiments, non-thermosetting materials may also be incorporated into the housing. |
