| 摘要 |
<p>The process for soldering or joining two components each other by a material, comprises producing a wettable surface of the solder material on surface of the components to be soldered or joined, depositing a quantity of solder material on the wettable surface to constitute a pad, depositing a flow (9) of liquid material in the surface for replenishing the deoxidation functions, reducing re-oxidation of the solder material after soldering, and heat transferring and for reducing the surface tension, and contacting a wettable surface of the other component with the solder material. The process for soldering or joining two components each other by a material, comprises producing a wettable surface of the solder material on surface of the components to be soldered or joined, depositing a quantity of solder material on the wettable surface to constitute a pad, depositing a flow (9) of liquid material in the surface for replenishing the deoxidation functions, reducing re-oxidation of the solder material after soldering, and heat transferring and for reducing the surface tension, contacting a wettable surface of the other component with the solder material, and raising the temperature of an enclosure where the components are positioned to ensure the welding or joining of the two components together by remelting effect. The first component (3) comprises electrically conductive metallic tracks (4) connected to external connecting pads (5). The surface produced on the first component is electrically contacted with the metal track. Different wettability zones are obtained by depositing an antiwetting coating (8) of low thickness between reception zones of the solder material and the external connection pads by plasma enhanced chemical vapor deposition.</p> |
