| 摘要 |
<p>A heat dissipation structure for PC-integrated TV is provided. The PC-integrated TV includes base frame, PC unit, TV unit, SMPS unit, PC-TV interface, and user interface. The PC unit includes PC main board including CPU and system chipset. The TV unit has TV main board including dual-core chip in which TV signal processor and controller are implemented by dual-core, and audio amplifier chip. First heat dissipation plate and cooler coupled to the first heat dissipation plate are disposed on the central processing unit mounted on the PC main board such that heat generated in the central processing unit is transferred to the first heat dissipation plate, second heat dissipation plate is disposed on the system chipset mounted on the PC main board such that heat generated in the system chipset is transferred to the second heat dissipation plate, third heat dissipation plate is disposed on the dual-core chip such that heat generated in the TV signal processor and the controller is transferred to the third heat dissipation plate, and fourth heat dissipation plate is mounted on the audio amplifier chip in vertical direction of the TV main board and has larger area than the audio amplifier chip. Heat generated in the PC main board and the TV main board can be effectively dissipated.</p> |
