| 发明名称 |
Method and apparatus for manufacturing IC chip packaged device |
| 摘要 |
A film substrate that has antenna circuits formed at a fixed spacing on one surface thereof is transported at a constant speed, and IC chips are moved along the film substrate, and are mounted at the fixed spacing on the film substrate so as to be connected to the antenna circuits.
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| 申请公布号 |
US7488619(B2) |
申请公布日期 |
2009.02.10 |
| 申请号 |
US20040595979 |
申请日期 |
2004.12.22 |
| 申请人 |
SHINKO ELECTRIC CO., LTD. |
发明人 |
INOUE TAICHI;ARIMA SUMIHIRO;NAGANO KAZUTAKA;MORITA MASASHI |
| 分类号 |
G06K19/077;H01L21/50;B23P19/00;B42D15/10;G06K19/00;G06K19/07;G08B13/14;G11C11/24;H01L21/00;H01L21/44;H01L21/48;H01L21/52;H01L21/60;H01L23/02;H01L23/498 |
主分类号 |
G06K19/077 |
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