| 摘要 |
<p>Disclosed is a method for producing a curing agent having an acidic substituent and an unsaturated maleimide group, wherein a maleimide compound (a) having at least two N-substituted maleimide groups in a molecule and an amine compound (b) having an acidic substituent represented by the general formula (I) below are reacted in an organic solvent. Also disclosed is a thermosetting resin composition containing a curing agent (A) obtained by the above-described method, and a compound (B) which is cured with the curing agent. A cured product of such a thermosetting resin composition has a glass transition temperature of not less than 200°C. Further disclosed are a prepreg using such a thermosetting resin composition, and a laminate. The curing agent produced by this method enables to obtain a thermosetting resin composition having good solubility in an organic solvent, while being excellent in adhesion to metal foils, heat resistance, moisture resistance, flame retardance, copper cladding heat resistance, low dielectric characteristics and low dielectric loss tangent property. Consequently, the curing agent enables to obtain a prepreg or a laminate having excellent properties useful for printed wiring boards for electronic devices.</p> |
