RESIN COMPOSITION, PREPREG, LAMINATE, AND WIRING BOARD

摘要

A resin composition which is inexpensive and lowly heat-expandable; a prepreg; a laminate; and a wiring board. The resin composition is for use in producing laminates and contains an insulating resin having aromatic rings. In the insulating resin in the stage of a laminate, the molecular weight of segments between the crosslinked sites, as determined from shear moduli at temperatures not lower than the Tg of the insulating resin having aromatic rings, is 300-1,000.