| 摘要 |
<p>A semiconductor package and method for fabricating of the same is provided to the reliability of the joint unit by forming a space for suppressing a stress from the outside through a ball land. In a semiconductor package and method for fabricating of the same, a metal wiring(206) is formed in the lower part of a substrate(200). The metal wiring comprises the ball land unit(B) for electrically connecting to the external circuit, and the ball land unit is bent from the rest of the metal wiring. The space is formed between the ball land unit and the lower part of the substrate. The insulating layer(208) is formed at the lower part of the substrate to limit the ball land unit. The stress applied from the outside to the ball land unit is suppressed by the space.</p> |
