| 摘要 |
An epoxy resin composition for encapsulating a semiconductor device is provided to ensure excellent flame retardancy without the use of a halogen-based flame retardant, moldability and reliability by using a bishydroxydeoxybenzoin-based polyphosphonate as a flame retardant. An epoxy resin composition for encapsulating a semiconductor device comprises epoxy resin, curing agent, curing accelerator, inorganic filler and flame retardant. The flame retardant is the bishydroxydeoxybenzoin-based polyphosphonate indicated as the chemical formula 1. In the chemical formula 1, the average of n is 10-120. The bishydroxydeoxybenzoin-based polyphosphonate has the average molecular weight of 10,000-40,000 and is used in the amount of 0.01~10 weight% based on the total epoxy resin composition.
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