EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

An epoxy resin composition for encapsulating a semiconductor device is provided to increase adhesive force with a semiconductor chip and a lead frame and to improve cracking resistance and peeling resistance. An epoxy resin composition for encapsulating a semiconductor device comprises an epoxy resin, curing agent, curing accelerator, adhesive strength improver and inorganic filler. The curing agent is represented by amino triazine-based modified phenol novolac resin indicated as the chemical formula 1. The adhesive strength improver is methyl / phenylsilsesquioxane resin indicated as the chemical formula 2. In the chemical formula 1, the average of m is 0-15 and the average of m is 0-10. The order of two repeating units can be arranged in the chemical formula 1 randomly. In the chemical formula 2, n is 1-20 and R1-R16 are independently a methyl radical or phenyl radical.