PLASMA TREATMENT APPARATUS

摘要

A plasma treatment apparatus is provided to reduce the footprint of equipment by optimizing arrangement of the forming location of the gate valve which the plasma processing apparatus is formed in a loadlock chamber and ATM robot. In a plasma treatment apparatus, a first transfer chamber(310), a first loadlock chamber(311) and the first processing chamber are placed in the first cluster. A second transfer chamber(320), a second load lock chamber(321) and the second processing chamber are placed in the second cluster. The substrate is exchanged between the first loadlock chamber, the second load lock chamber, and a cassette by the ATM robot(330). The first gate valve(311a) and the second gate valve(321a) for accepting the substrate are equipped on one side of the first loadlock chamber and the second load lock chamber. The first gate valve and the second gate valve are installed to mutually face.