| 摘要 |
PROBLEM TO BE SOLVED: To perform the diffusion bonding of a copper-made thin-walled pipe with a workpiece with the bonding result of high bonding quality such as desired bonding strength and the appearance. SOLUTION: In a method for performing the diffusion bonding of a copper-made thin-walled pipe for bonding the copper-made thin-walled pipe W1 with a workpiece W2 by conducting the pulse-shaped bonding current while applying the pressure therebetween, the wall thickness of the copper-made thin-walled pipe W1 is≥0.6 mm and≤1.5 mm; a fore end face of the copper-made thin-walled pipe W1 is at least covered by a low melting point metallic membrane M having the electric resistance larger than that of copper; the width at a root of an annular projecting part P2 of the workpiece W2 is D and the inside diameter thereof is smaller than the inside diameter of the copper-made thin-walled pipe W1; the outside diameter thereof is larger than the outside diameter of the copper-made thin-walled pipe W1; and the relationship between the wall thickness d of the copper-made thin-walled pipe W1 and the width D at the root of the annular projecting part P2 satisfies inequalities d≤D≤2.5d. COPYRIGHT: (C)2009,JPO&INPIT |
