| 摘要 |
PROBLEM TO BE SOLVED: To surely prevent warpage in a simple configuration in a warpage preventing mechanism of a soldering device for performing soldering to a printed wiring board moved on a solder tank. SOLUTION: Between the solder tank and the printed wiring board, a rail is disposed at such a position that it is separated from the printed wiring board on the upstream side along the moving direction of the printed wiring board and continuously approaches it to the position for blocking the warpage at the upper part of the solder tank, a through-hole is formed at the position facing the rail of the printed wiring board, and the warpage preventing mechanism of the soldering device is provided with a warpage preventing body 5 formed of an attaching shaft 51 freely slidably inserted to the through-hole, a detachment prevention part 52 attached to the upper end of the attaching shaft 51, an abutting part 53 attached to the lower end and freely abutted and separated to/from the rail, and a spacer 54 for limiting the downward warpage of the printed wiring board in a state where the abutting part 53 is abutted on the rail. COPYRIGHT: (C)2009,JPO&INPIT |
