发明名称 |
Conductor Bump Method and Apparatus |
摘要 |
Various semiconductor die conductor structures and methods of fabricating the same are provided. In one aspect, a method of manufacturing is provided that includes forming a conductor structure on a conductor pad of a semiconductor die. The conductor layer has a surface. A polymeric layer is formed on the surface of the conductor layer while a portion of the surface is left exposed. A solder structure is formed on the exposed portion of the surface and a portion of the polymeric layer. |
申请公布号 |
US2009032940(A1) |
申请公布日期 |
2009.02.05 |
申请号 |
US20070832486 |
申请日期 |
2007.08.01 |
申请人 |
|
发明人 |
TOPACIO RODEN R.;MCLELLAN NEIL;LOW YIP SENG;LEUNG ANDREW KW |
分类号 |
H01L23/488;H01L21/44;H01L21/60 |
主分类号 |
H01L23/488 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|