TAMPER-RESISTANT SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THEREOF

摘要

The invention relates to a tamper-resistant semiconductor device comprising a substrate (5) comprising an electronic circuit arranged on a first side thereof. An electrically- conductive protection layer (50, 50a, 50b) is arranged on a second side of the substrate (5) opposite to the first side. At least three through-substrate electrically-conductive connections (45) extend from the first side of the substrate (5) into the substrate (5) and in electrical contact with the electrically- conductive protection layer (50, 50a, 50b) on the second side of the substrate (5). A security circuit is arranged on the first side connected to the through- substrate electrically-conductive connections (45) and is arranged for measuring at least two resistance values (R12, R23, R34, R14, R13, R24) of the electrically- conductive protection layer (50, 50a, 50b) through the through-substrate electrically-conductive connections (45). The security circuit is further arranged for comparing the measured resistance values (R12, R23, R34, R14, R13, R24) with reference resistance values.