发明名称 CIRCUIT MODULE AND ELECTRIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To solve the following problem: deterioration in signals is inevitable when a circuit module is constituted by stacking a plurality of solid circuit portions. <P>SOLUTION: An electric component having a solid circuit portion and a substrate connection portion is characterized in that the solid circuit portion has a support surface for supporting the substrate connection portion and an opposition surface opposed to another solid circuit portion outside the support portion and can be disposed in such a way that the opposition surface is opposed to an opposition surface of the other solid circuit portion. ELectronic components having substrate connection portions differing in height are prepared, then, can be arranged zigzag on a circuit board. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009026884(A) 申请公布日期 2009.02.05
申请号 JP20070187258 申请日期 2007.07.18
申请人 ELPIDA MEMORY INC 发明人 ONO TAKAO
分类号 H01L25/10;H01L25/00;H01L25/11;H01L25/18 主分类号 H01L25/10
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