发明名称 SHEET STICKING DEVICE AND STICKING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a sheet sticking device and a sticking method which can stick a sticking sheet sized within an adherend surface of an adherend of a wafer or the like without damaging the adherend. SOLUTION: There is provided the sheet sticking device 10 using a belt-like rolled material R having a first release sheet A temporarily stuck on one surface of an adhesive sheet S and a second release sheet B stuck on another surface. The sheet sticking device 10 includes a feeding means 13 of feeding the rolled material, a cutting means 15 of making a cut C reaching the second release sheet B from the first release sheet A to form a sticking sheet S1 sized within the adherend surface of the wafer W, a collection means 16 of collecting an outside adhesive sheet part S2 disposed outside the sticking sheet S1 and an outside release sheet part A1 overlapping it as an outside unnecessary sheet D and an inside release sheet part A2 overlapping the sticking sheet S1 as an inside unnecessary sheet E, a sticking means 18 of sticking the sticking sheet S1 on the wafer W on a table 12; and a cutting means 19 of cutting the second release sheet B along an outer periphery of the wafer W. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009026904(A) 申请公布日期 2009.02.05
申请号 JP20070187727 申请日期 2007.07.19
申请人 LINTEC CORP 发明人 MURAKAMI YUKINORI
分类号 H01L21/683 主分类号 H01L21/683
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