ANCHORING STRUCTURE AND INTERMESHING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide an anchoring structure and an intermeshing structure which prevent metal lines from being lifted off from a surface of a chip to come off the chip in a temperature cycling (TC) reliability test for a semiconductor device. SOLUTION: The anchoring structure for a metal structure 210 of the semiconductor device includes an anchoring recess structure 220 having at least one overhanging side wall 230. The metal structure 210 is at least partly arranged within the anchoring recess structure 220. COPYRIGHT: (C)2009,JPO&INPIT