发明名称 |
Printed circuit board arrangement for use as e.g. connection element, for electronic modules of electrical circuit, has printed circuit board free from through-hole technology module, and other board provided with technology modules |
摘要 |
<p>The arrangement (1) has a printed circuit board (2) connected with another printed circuit board (3) by spacer elements (4, 5) in an electrically conductive manner. The spacer elements are formed as surface mount device (SMD) modules (10-12) on a side that contacts the former printed circuit board. The former printed circuit board is through-hole technology module free, and through-hole technology modules (13, 14) are fixed on the latter printed circuit board in an electrically conductive manner. The printed circuit boards are arranged parallel to each other. An independent claim is also included for a method for manufacturing a printed circuit board arrangement.</p> |
申请公布号 |
DE102007035794(A1) |
申请公布日期 |
2009.02.05 |
申请号 |
DE20071035794 |
申请日期 |
2007.07.31 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
NUECHTER, WOLFGANG;DEIER, ERIK |
分类号 |
H05K3/32;H01R12/55;H05K1/14 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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