| 摘要 |
A socket for a semiconductor device is provided to attach and arrange an adaptor member on a wiring substrate, have a socket body connecting surface and support a socket body, thereby disassembling a socket body from an adaptor member easily and replacing only an IC socket having an error within a short time. A socket for a semiconductor device comprises a socket main body, the first contact terminal, an adapter member(10) and the second contact terminal. The socket main body has a semiconductor device accommodating unit accommodating the semiconductor device. The first contact terminal has a pair of contact piece units and a socket main body connecting surface. The pair of contact piece units are arranged in the semiconductor device accommodating unit. And the pair of contact piece units selectively inserts and supports a terminal of the semiconductor device. The socket main body connecting surface is arranged to be attached/detached on/from the wiring substrate(18). The socket main body is attached/detached to/from the socket main body connecting surface. The adaptor member supports the socket main body. The second contact terminal electrically connects the terminal of the semiconductor device to an electrode surface of the wiring substrate through the first contact terminal.
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