| 摘要 |
Conductive particles are provided to obtain an anisotropic conductive film of high quality for welding the parts for a fine pitch and to ensure stability and economical efficiency. Conductive particles are used as a material for manufacturing an anisotropic conductive film consisting of at least one adhesive layer and a plurality of conductive particles. The conductive particles is made of a conductive thin film layer(TF) plated with a portion of a base layer(S) including a patterning layer(P) and a pit portion(PI), or comprises the conductive thin film layer as a main material. The patterning layer is formed at one side of the base layer with a patterning method and includes one or more pit portions. The pit portion comprises pit or pit group passing through the patterning layer in at least one place of the patterning layer. At least one pit portion per 1 mm^2 area exists in an independently separated form without being connected with the other pit portion. The conductive thin film layer is formed with the thickness grown from the bottom of pit portion and has the area less than 1 mm and thicknesses more than 10nm.
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