| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor element which has good transparency and excellent soldering resistance. <P>SOLUTION: The epoxy resin composition for sealing an optical semiconductor element contains a (B) component and a (C) component in addition to a (A) component. The (A) component is an epoxy resin, the (B) component is a curing agent containing, as an essential ingredient, a phenol resin having a specific chemical structure, and the (C) component is a cure-accelerating agent formed from at least one of an imidazole-based compound and an organic phosphine compound. <P>COPYRIGHT: (C)2009,JPO&INPIT |
