| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC tag capable of reinforcing the protection of an IC chip. <P>SOLUTION: This IC tag comprises an IC chip, a sheet, an adhesive layer, and a separator. The IC chip is mounted on one face of the sheet, and the sheet is bent like a loop. The adhesive layer is formed on the other face of the sheet. The separator is formed to cover the adhesive layer. At least a portion of the adhesive face of the adhesive layer is exposed in a region corresponding to one end of the sheet, and one end of the sheet is adhered through the region corresponding to one end of the sheet in the separator and the adhesive layer, and bent at the other end of the sheet, and adhered through the other face of the sheet and the adhesive layer so that the position corresponding to the IC chip on the other face of the sheet can be covered. Thus, it is possible to doubly cover the IC chip with the sheet in comparison with a general IC tag. Therefore, it is possible to reinforce the protection of the IC chip. <P>COPYRIGHT: (C)2009,JPO&INPIT |
