| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To attach a load port device on the attaching surface of a manufacturing device in a simple manner, while decreasing the number of procedures to significantly decrease the installation time. <P>SOLUTION: An attaching device A<SB>1</SB>is for attaching the load port device L that mounts a wafer carrier with the wafer housed to the attaching surface 51 of the outside of a wall body 50 of a semiconductor manufacturing device E, in order to carry in and carry out the wafer between the semiconductor manufacturing device E and itself. A truck body B is attached to the lower end part of the load port device L, a pair of left and right positioning convex parts 10 are provided downward in a protrusive manner to the backside of the truck body B, and a support plate 22 with a pair of positioning concave part 23 for fitting the pair of positioning convex part 10 formed on its upper surface is provided, in a protruding manner at the near side of the lower end part of the attaching surface 51. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
