| 摘要 |
PROBLEM TO BE SOLVED: To provide a means with which a semiconductor apparatus can be mounted on a substrate of a different kind in which a land is disposed at a different position using a common sealing part. SOLUTION: In a lead 3 provided in a sealing part 2, a first straight line part 41, a second straight line part 42 and a third straight line part 43 parallel with the surface of a substrate are formed by bending the lead 3. The first straight line part 41 is formed at a position facing a first land, the second straight line part 42 is formed at a position facing a second land, the third straight line part 43 is formed at a position facing a third land. The first straight line part 41 is connected to the first land to mount the semiconductor apparatus 1, the first straight line part 41 is cut off and then the second straight line part 42 is connected to the second land to mount the semiconductor apparatus 1, and the first straight line part 41 and the second straight line part 42 are cut off and the third straight line part 43 is connected to the third land to mount the semiconductor apparatus 1. COPYRIGHT: (C)2009,JPO&INPIT
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