MOUNTING STRUCTURE FOR LEDS, LED ASSEMBLY, LED ASSEMBLY SOCKET, METHOD FOR FORMING A MOUNTING STRUCTURE

摘要

A mounting structure (10) for at least one LED (20) comprises a substrate (11) comprising silicon and/or another semiconductor, wherein at least one mounting portion (14) formed in a front surface (12) of said substrate for mounting at least one LED chip (21) thereon, and cooling grooves (16, 16a, 16b) or channels for a cooling fluid are formed in the substrate, preferably in or beneath a rear surface (13) thereof.