| 摘要 |
A semiconductor package device and manufacturing method thereof are provided to improve the reliability of the electrical contact of junction under the thermal cycle ring environment according to the operation of the semiconductor chip by forming the exposed lead frame package. The semiconductor package device(10) comprises the semiconductor chip(2) protected by the packout section(1) and the substrate(3), the semiconductor chip, the mount and lead(7) and the joining material(8). The front end part(4) of the lead is electrically connected to the semiconductor chip, the back end is extended to the substrate. The joining material be electrically connected between the junction of the lead and the substrate. The bonding material is solder, gold, copper, silver, other including aluminum etc. The packout section surrounds one side of the semiconductor chip and the wire. |
