发明名称 ONE PACK MOISTURE-CURING TYPE ADHESIVE FOR INTERIOR
摘要 PROBLEM TO BE SOLVED: To provide a one pack moisture-curing type adhesive for interiors, which is used for adhering a floor material to a floor substrate, can easily be coated to the floor substrate, and can exert a high shear adhesive strength, a low crack adhesive strength and a low peeling adhesive strength, after adhered. SOLUTION: The adhesive comprises a homogeneous mixture of a powder component (X) with a liquid component (Y), and has a viscosity of 10 to 150 Pa s. The powder component (X) comprises a hollow powder (a) and a solid powder (b) which act as fillers. The liquid component (Y) comprises a moisture reaction-curable hydrolysable silyl group-containing polyoxyalkylene polymer (c) and a non-reacting liquid component (d) consisting mainly of a high molecular polymer such as polypropylene glycol. The adhesive is used for adhering between floors and floor substrates, joists and floor substrates, and bundles and foundations. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009024096(A) 申请公布日期 2009.02.05
申请号 JP20070189360 申请日期 2007.07.20
申请人 KONISHI CO LTD 发明人 ITO YUSUKE;SATO AKIHIRO;KOGA SHIGEYUKI;INOUE FUMIKO
分类号 C09J171/02;C09J201/00 主分类号 C09J171/02
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